Pro procesory Intel

Intel® B660 (LGA 1700) mATX motherboard, 10+1 DrMOS Power stages , PCIe 5.0 support, DDR4 5333 (OC), Dual PCIe 4.0 M.2 Slots with Flexible Heatsink, Realtek 2.5Gb Ethernet, Rear USB 3.2 Gen 2x2 Type-C

CPU Intel® Socket LGA1700 for 13th Gen Intel® Core™ Processors & 12th Gen Intel® Core™, Pentium® Gold and Celeron® Processors* Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Tec

TUF GAMING B760M-PLUS D4 takes all the essential elements of the latest Intel® processors and combines them with game-ready features and proven durability. Engineered with military-grade components, a

TUF GAMING B760M-PLUS WIFI využívá všechny výhody nejnovějších procesorů Intel® a kombinuje je s funkcemi určenými pro hraní her a osvědčenou odolností. Tato základní deska je vybavena komponenty voje

CPU Intel® Socket LGA1700 for 13th Gen Intel® Core™ & 12th Gen Intel® Core™, Pentium® Gold and Celeron® Processors* Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0

CPU Intel® Socket LGA1700 for 13th Gen Intel® Core™ Processors & 12th Gen Intel® Core™, Pentium® Gold and Celeron® Processors* Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Tec

Intel® Z790 (LGA1700) ATX Gaming motherboard, 16+1 DrMOS power stages, PCIe® 5.0, DDR5 memory, four M.2 slots, WiFi 6E and Intel 2.5 Gb Ethernet, HDMI®, DisplayPort™, USB 3.2 Gen 2x2 Type-C®, front US

CPU Intel® LGA 1700 socket: Ready for Intel® Core™ 14th & 13th Gen Intel® Core™ processors, Intel® Core™ 12th Gen, Pentium® Gold and Celeron® Processors Supports Intel® Turbo Boost Technology 2.0 and

Chipset: Intel® B760 Express Rozměrový formát: Micro ATX (244x244mm) Podpora pro procesory: 13. a 12. generace Intel® Core™, Pentium® Gold a Celeron® Patice procesoru: LGA1700 Paměť: 4x DIMM patice

CPU LGA1700 socket: Support for the 13th and 12thGeneration Intel® Core™, Pentium® Gold and Celeron® Processors L3 cache varies with CPU (Please refer to "CPU Support List" for more information.) Chip

Chipset: Intel® H510 Express Rozměrový formát: Micro ATX (226x185mm) Podpora pro procesory: 11. a 10. generace Intel® Core™, Pentium® a Celeron® Patice procesoru: LGA1200 Paměť: 2x DIMM patice podpo

Chipset: Intel® H510 Express Rozměrový formát: Micro ATX (226x185mm) Podpora pro procesory: 11. a 10. generace Intel® Core™, Pentium® a Celeron® Patice procesoru: LGA1200 Paměť: 2x DIMM patice podpo